Visual impairment significantly restricts independent mobility and environmental awareness, especially in developing nations where advanced assistive technologies remain prohibitively expensive. Existing smart-wearable prototypes frequently rely on standalone microcontroller platforms such as the ESP32-CAM, which suffer from severe thermal throttling, limited memory, and bulky battery requirements when deployed for continuous real-time computer vision tasks. This paper presents Vision-Link AI, a novel, cost-effective wearable assistive device that circumvents these hardware limitations through a hybrid architecture. The system utilizes a lightweight OTG (On-The-Go) endoscope camera integrated with a standard smartphone via edge computing for visual perception, coupled with a custom-built, frame-mounted Bluetooth audio receiver for discreet spatial feedback. By offloading the visual computational workload to the smartphone's processor using optimized, quantized deep-learning models, the system achieves real-time obstacle detection with an end-to-end response latency below 120 ms. The integrated hardware, comprising a custom power-distribution circuit and a class-D audio amplification chain driven by a 3.7 V lithium battery dedicated solely to audio and illumination, delivers instant Text-to-Speech (TTS) guidance while remaining cool to the touch under continuous operation (approximately 27 °C ambient). This hybrid architecture drastically reduces cost relative to both cloud-dependent and fully embedded designs, prevents the thermal issues characteristic of ESP32-class wearables, and provides a highly scalable, ergonomic solution for the visually impaired.
Original Article
Development of a Cost-Effective, AI-Powered Assistive Wearable for the Visually Impaired Using OTG Endoscope Technology and Smartphone Edge Computing
Volume 001 (2026) — Issue 01 · Pages 33–40
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Abstract
Keywords
Assistive technology; visually impaired; edge computing; OTG endoscope; object detection; MobileNetV2; YOLOv3; Bluetooth audio; wearable electronics; thermal management